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Dallas–Fort Worth, TX Press Releases
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(Dallas.CityRegions.Com, January 01, 2019 ) In this report, LP Information studies the present scenario (with the base year being 2017) and the growth prospects of global System in Package Technology market for 2018-2023.
SiP is a packaging technology, which contains multiple die in a single module. It is a mixture of various integrated circuits in a compact size, which further reduces the cost to develop and assemble a printed circuit board (PCB). SiP dies can be stacked vertically or tiled horizontally with standard off-chip wire bonds or solder bumps.
Over the next five years, LPI(LP Information) projects that System in Package (SiP) Technology will register a xx% CAGR in terms of revenue, reach US$ xx million by 2023, from US$ xx million in 2017.
This report presents a comprehensive overview, market shares and growth opportunities of System in Package (SiP) Technology market by product type, application, key companies and key regions.
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The key players covered in this report: Amkor Technology Fujitsu Toshiba Corporation Qualcomm Incorporated Renesas Electronics Corporation Samsung Electronics Jiangsu Changjiang Electronics Technology ChipMOS Technologies Powertech Technologies ASE Group
Segmentation by product type: 2-D IC Packaging 2.5-D IC Packaging
Segmentation by application: Consumer Electronics Automotive Telecommunication Industrial System Aerospace & Defense Others (Traction & Medical)
Have a query? Please click here: https://www.orbisresearch.com/contacts/enquiry-before-buying/2346535 Some TOC Points:
1 Scope of the Report
1 Scope of the Report 1.1 Market Introduction 1.2 Research Objectives 1.3 Years Considered 1.4 Market Research Methodology 1.5 Economic Indicators 1.6 Currency Considered
2 Executive Summary 2 Executive Summary
2.1 World Market Overview
2.1.1 Global System in Package (SiP) Technology Market Size 2013-2023
2.1.2 System in Package (SiP) Technology Market Size CAGR by Region
2.2 System in Package (SiP) Technology Segment by Type
2.2.1 2-D IC Packaging
2.2.2 2.5-D IC Packaging
2.2.3 3-D IC Packaging
2.3 System in Package (SiP) Technology Market Size by Type
2.3.1 Global System in Package (SiP) Technology Market Size Market Share by Type (2013-2018)
2.3.2 Global System in Package (SiP) Technology Market Size Growth Rate by Type (2013-2018)
2.4 System in Package (SiP) Technology Segment by Application
2.4.1 Consumer Electronics
2.4.2 Automotive
2.4.3 Telecommunication
2.4.4 Industrial System
2.4.5 Aerospace & Defense
2.4.6 Others (Traction & Medical)
2.5 System in Package (SiP) Technology Market Size by Application
2.5.1 Global System in Package (SiP) Technology Market Size Market Share by Application (2013-2018)
2.5.2 Global System in Package (SiP) Technology Market Size Growth Rate by Application (2013-2018)….. &Continued
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